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Encapsulation
New
SLOW REACTIVITY AMBIENT CURE EPOXY SYSTEMMBR
818 (Part A) is a modified liquid epoxy resin based on
bisphenol- A with moderate viscosity.MBH
9542 (Part B) is a modified anhydride hardener in
liquid formA 6741
(Accelerator) is
a modified accelerator designed to enhance the curing process ..
New
AMBIENT TEMPERATURE CURE CASTING RESIN SYSTEMMBR
8924 (Part A) consists of modified epoxy resin. Room
temperature cure modified resin system. Recommended for potting and
encapsulation or electrical and electronic components. Complies with EU and
RoHS.MBH
9159 (Part B) is polyamine hardenerFeatu..
New
PRE-FILLED, ELEVATED TEMPERATURE CURE EPOXY RESIN SYSTEMMBR
8948 (Part A) this is a high viscosity pre-filled epoxy
resin.MBH
9273 (Part B) this is a low viscosity anhydride
hardener. Features & Benefits:
Hardener
reinforced with vacuum mixed processed fillers
..
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